Phase II of the Xi'an Yiswei Silicon Industrial Base is located in the Chang'an Communications Industrial Park within the Xi'an High-Tech Zone. As a national key project for large-size silicon wafers for integrated circuits, it is being developed by Xi'an Yiswei Materials Technology Co., Ltd. with a total investment of approximately 12.5 billion yuan. The project covers an area of 167 mu and has a total floor area of approximately 178,000 square meters. The project is scheduled for completion in July 2024 and primarily involves the construction of a full-process production line for 12-inch integrated circuit silicon wafers (including crystal pulling, polishing, and epitaxy). With a planned production capacity of 500,000 wafers per month, the project will, upon reaching full capacity, combine with Phase I to achieve a combined monthly production capacity of 1 million wafers. This will help alleviate the domestic shortage of 12-inch silicon wafers and enhance the technological level and supply chain competitiveness of China’s semiconductor silicon materials industry.