The project has three major technological advantages: fan-out type, high density and high bandwidth, and panel-level packaging, which can improve chip integration. The size of the carrier board is 510mm×515mm, and the technology platform can correspond to a variety of advanced packaging and Chiplet programs, and the products are applied in various fields such as mobile terminals. The total investment of the first phase of the project is 5.53 billion yuan, and construction will start at the end of 2021, and the equipment will be moved in October 2022, and mass production will be realized in the fourth quarter of 2023, and it is expected to become an industry-leading intelligent production base for packaging and testing in the future.